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Stacked MCP
Overview
This is a product that combines flash memory, mobile specified RAM, low power SRAM and other Memory IC chips in a single package.
Any memory combination is possible.
Features
Up to 4 chips in one package with a package height of no more than 1.4 mm
Packages with RAM-only combinations (mobile specified RAM and low power SRAM) also available
Products development by any memory combinations can allow customization.
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